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caution : observe precautions when handling because these devices are sensitive to electrostatic discharge . 3 v, super minimold silicon mmic wideband amplifier for mobile communications bipolar analog integrated circuit ? p c 2745tb, ? p c 2746tb the mark ? shows major revised points. document no. pu10443ej01v0ds ( 1st edition) (previous no. p11511ej3v0ds00) date published november 2003 cp(k) description the ? pc2745tb and ? pc2746tb are silicon monolithic integrated circuits designed as buffer amplifier for mobile communications. these low current amplifiers operate on 3.0 v (1.8 v min.). these ics are manufactured using our 20 ghz f t nesatiii silicon bipolar process. this process uses silicon nitride passivation film and gold electrodes. these materials can protect chip surface from external pollution and prevent corrosion/migration. thus, these ic have excellent performance, uniformity and reliability. features ? supply voltage : recommended v cc = 2.7 to 3.3 v circuit operation v cc = 1.8 to 3.3 v ? upper limit operating frequency : ? pc2745tb; f u = 2.7 ghz typ.@3 db bandwidth ? pc2746tb; f u = 1.5 ghz typ.@3 db bandwidth ? high isolation : ? pc2745tb; isl = 38 db typ.@f = 500 mhz ? pc2746tb; isl = 45 db typ.@f = 500 mhz ? power gain : ? pc2745tb; g p = 12 db typ.@f = 500 mhz ? pc2746tb; g p = 19 db typ.@f = 500 mhz ? saturated output power : ? pc2745tb; p o(sat) = ? 1 dbm t yp.@f = 500 mhz ? pc2746tb; p o(sat) = 0 dbm typ.@f = 500 mhz ? high - density surface mounting : 6 - pin super minimold package (2.0 ? 1.25 ? 0.9 mm) application s ? 1.5 ghz to 2.5 ghz com munication system : ? pc2745tb ? 800 mhz to 900 mhz communication system : ? pc2746tb ordering information part number package marking supplying form ? pc2745tb - e3 - a 6 - pin super minimold c1q ? embossed tape 8 mm wide ? 1, 2, 3 pins face the perforation side of the tape ? qty 3 kpcs/reel ? pc2746tb - e3 - a c1r remark to order evaluation samples, contact your nearby sales office . part number for sample order : ? pc2745tb - a , ? pc2746tb - a
data sheet pu10443ej1v0ds 2 ? pc2745tb, ? pc2746tb pin connection pin n o. pin name 1 input 2 gnd 3 gnd 4 output 5 gnd 6 v cc product line - up (t a = +25 ? cc = 3.0 v, z s = z l = 50 ? part no. f u (ghz) p o(sat) (dbm) g p (db) nf (db) i cc (ma) package making ? pc2745t 2.7 ? 1.0 12 6.0 7.5 6 - pin minimold c1q ? pc2745tb 6 - pin super minimold ? pc2746t 1.5 0 19 4.0 7.5 6 - pin minimold c1r ? pc2746tb 6 - pin super minimold ? pc2747t 1.8 ? 7.0 12 3.3 5.0 6 - pin minimold c1s ? pc2747tb 6 - pin super minimold ? pc2748t 0.2 to 1.5 ? 3.5 19 2.8 6.0 6 - pin minimold c1t ? pc2748tb 6 - pin super minimold ? pc2749t 2.9 ? 6.0 16 4.0 6.0 6 - pin minimold c1u ? pc2749tb 6 - pin supe r minimold remark typical performance. please refer to electrical characteristics in detail. caution the package size distinguish between minimold and super minimold. system application example digital cellular system block diagram marking is an example of ? pc2745tb
data sheet pu10443ej1v0ds 3 ? pc2745tb, ? pc2746tb pin explanation pin no. pin name applied voltage (v) pin voltage (v) note function and applications internal equivalent circuit 1 input ? 0.87 signal input pin. a internal matching circuit, configured with resistors, enables 50 ? connection o ver a wide band. this pin must be coupled to signal source with capacitor for dc cut. 0.82 2 3 5 gnd 0 ? ground pin. this pin should be connected to system ground with minimum inductance. ground pattern on the board should be formed as wide as possible. all the ground pins must be connected together with wide ground pattern to decrease impedance difference. 4 output ? 1.95 signal output pin. a internal matching circuit, configured with resistors, enables 50 ? connection over a wide band. th is pin must be coupled to next stage with capacitor for dc cut. 2.54 6 v cc 2.7 to 3.3 ? power supply pin. this pin should be externally equipped with bypass capacity to minimize ground impedance. note pin voltage is measured at v cc = 3.0 v. ab ove: ? pc2745tb, below: ? pc2746tb
data sheet pu10443ej1v0ds 4 ? pc2745tb, ? pc2746tb absolute maximum ratings parameter symbol conditions ratings unit supply voltage v cc t a = +25 ? c 4.0 v circuit current i cc t a = +25 ? c 16 ma power dissipation p d t a = +85 ? c note 270 mw operating ambient tem perature t a ? 40 to +85 ? c storage temperature t stg ? 55 to +150 ? c input power p in t a = +25 ? c 0 dbm note mounted on double - sided copper - clad 50 ? 50 ? 1.6 mm epoxy glass pwb recommended operating range parameter symbol min. typ. max. unit supply voltage v cc 2.7 3.0 3.3 v electrical characteristics (t a = +25 ? cc = 3.0 v, z s = z l = 50 ? parameter symbol test conditions ? pc2745tb ? pc2746tb unit min. typ. max. min. typ. max. circuit current i cc no signal 5.0 7.5 10.0 5.0 7.5 10.0 ma power gain g p f = 500 mhz 9 12 14 16 19 21 db noise figure nf f = 500 mhz ? 6.0 7.5 ? 4.0 5.5 db upper limit operating frequency f u 3 db down below from gain at f = 0.1 ghz 2.3 2.7 ? 1.1 1.5 ? ghz isolation isl f = 500 mhz 33 38 ? 40 45 ? db input return loss rl in f = 500 mhz 8 11 ? 10 13 ? db output return loss rl out f = 500 mhz 2.5 5.5 ? 5.5 8.5 ? db saturated output power p o(sat) f = 500 mhz, p in = ? 6 dbm ? 4.0 ? 1.0 ? ? 3.0 0 ? dbm
data sheet pu10443ej1v0ds 5 ? pc2745tb, ? pc2746tb standard characteristics for refere nce (t a = +25 ? cc = 3.0 v, z s = z l = 50 ? parameter symbol test conditions reference value unit ? pc2745tb ? pc2746tb circuit current i cc v cc = 1.8 v, no signal 4.5 4.5 ma power gain g p v cc = 3.0 v, f = 1.0 ghz v cc = 3.0 v, f = 2.0 ghz v cc = 1. 8 v, f = 0.5 ghz 12.0 11.0 7.0 18.5 ? 14.0 db noise figure nf v cc = 3.0 v, f = 1.0 ghz v cc = 3.0 v, f = 2.0 ghz v cc = 1.8 v, f = 0.5 ghz 5.5 5.7 8.0 4.2 ? 5.0 db upper limit operating frequency f u v cc = 1.8 v, 3 db down below from gain at f = 0.1 ghz 1.8 1.1 ghz isolation isl v cc = 3.0 v, f = 1.0 ghz v cc = 3.0 v, f = 2.0 ghz v cc = 1.8 v, f = 0.5 ghz 33 30 35 38 ? 37 db input return loss rl in v cc = 3.0 v, f = 1.0 ghz v cc = 3.0 v, f = 2.0 ghz v cc = 1.8 v, f = 0.5 ghz 13.0 14.0 6.5 10.0 ? 10.0 db output r eturn loss rl out v cc = 3.0 v, f = 1.0 ghz v cc = 3.0 v, f = 2.0 ghz v cc = 1.8 v, f = 0.5 ghz 6.5 8.5 6.0 8.5 ? 9.5 db saturated output power p o(sat) v cc = 3.0 v, f = 1.0 ghz, p in = ? 6 dbm v cc = 3.0 v, f = 2.0 ghz, p in = ? 6 dbm v cc = 1.8 v, f = 0.5 ghz, p in = ? 10 dbm ? 2.5 ? 3.5 ? 11.0 ? 1.0 ? ? 8.0 dbm 3rd order intermodulation distortion im 3 v cc = 3.0 v, p out = ? 10 dbm, f 1 = 500 mhz, f 2 = 502 mhz v cc = 1.8 v, p out = ? 20 dbm, f 1 = 500 mhz, f 2 = 502 mhz v cc = 3.0 v, p out = ? 10 dbm, f 1 = 1 000 mhz, f 2 = 1 002 mh z ? 30.0 ? 31.0 ? 26.0 ? 26.0 ? 37.0 ? dbc
data sheet pu10443ej1v0ds 6 ? pc2745tb, ? pc2746tb test circuit example of application circuit the application circuits and their parameters are for references only and are not intended for use in actual design - ins. capacitors for the v cc , input, a nd output pins capacitors of 1 000 pf are recommendable as the bypass capacitor for the v cc pin and the coupling capacitors for the input and output pins. the bypass capacitor connected to the v cc pin is used to minimize ground impedance of v cc pin. so, stable bias can be supplied against v cc fluctuation. the coupling capacitors, connected to the input and output pins, are used to cut the dc and minimize rf serial impedance. their capacitance are therefore selected as lower impedance against a 50 ? load . the capacitors thus perform as high pass filters, suppressing low frequencies to dc. to obtain a flat gain from 100 mhz upwards, 1 000 pf capacitors are used in the test circuit. in the case of under 10 mhz operation, increase the value of coupling cap acitor such as 10 000 pf. because the coupling capacitors are determined by equation, fc = 1/(2 ? r c ).
data sheet pu10443ej1v0ds 7 ? pc2745tb, ? pc2746tb illustration of the test circuit assembled on evaluation board for more information on the use of this ic, refer to the following applicati on note: usage and applications of 6 - pin mini - mold, 6 - pin super mini - mold silicon high - frequency wideband amplifier mmic (p11976e). component list value c 1 000 pf
data sheet pu10443ej1v0ds 8 ? pc2745tb, ? pc2746tb typical characteristics (t a = +25 ? ? ? pc2745tb ? remark the graphs indicate nominal characteristics.
data sheet pu10443ej1v0ds 9 ? pc2745tb, ? pc2746tb ? ? pc2745tb ? remark the graphs indicate nominal characteristics.
data sheet pu10443ej1v0ds 10 ? pc2745tb, ? pc2746tb smith chart (t a = +25 ? cc = 3.0 v) ? ? pc2745tb ? s 11 - frequency s 22 - frequency
data sheet pu10443ej1v0ds 11 ? pc2745tb, ? pc2746tb s - parameters
data sheet pu10443ej1v0ds 12 ? pc2745tb, ? pc2746tb typical characteristics (t a = +25 ? ? ? pc2746tb ? remark the graphs indicate nominal characteristics.
data sheet pu10443ej1v0ds 13 ? pc2745tb, ? pc2746tb ? ? ? remark the graphs indicate nominal characteristics.
data sheet pu10443ej1v0ds 14 ? pc2745tb, ? pc2746tb smith chart (t a = +25 ? cc = 3.0 v) ? ? pc2746tb ? s 11 - frequency s 22 - frequency
data sheet pu10443ej1v0ds 15 ? pc2745tb, ? pc2746tb s - parameters
data sheet pu10443ej1v0ds 16 ? pc2745tb, ? pc2746tb package dimensions 6 - pin super minimold (unit: mm)
data sheet pu10443ej1v0ds 17 ? pc2745tb, ? pc2746tb notes on correct use (1) observe precautions for handling because of electro - static sensitive devices. (2) form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). all the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) the bypass capacitor should be attached to the v cc pin. (4) the dc cut capacitor must be attached to input pin and output pin. recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than thos e recommended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 ? c or below time at peak temperature : 10 seconds or less time at temperatur e of 220 ? c or higher : 60 seconds or less preheating time at 120 to 180 ? c : 120 ? 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below ir260 vps peak temperature (package surface temper ature) : 215 ? c or below time at temperature of 200 ? c or higher : 25 to 40 seconds preheating time at 120 to 150 ? c : 30 to 60 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below vp215 wa ve soldering peak temperature (molten solder temperature) : 260 ? c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 ? c or below maximum number of flow processes : 1 time maximum chlorine conten t of rosin flux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (pin temperature) : 350 ? c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below hs350 ca ution do not use different soldering methods together (except for partial heating).

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